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Nirmal, A. V.
- Characterization and Mitigation of Electro-Static Bonding Failures in Microsensors
Abstract Views :191 |
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Authors
Affiliations
1 Systems Engineering Group, ISRO Satellite Centre, IN
1 Systems Engineering Group, ISRO Satellite Centre, IN
Source
ICTACT Journal on Microelectronics, Vol 3, No 1 (2017), Pagination: 345-348Abstract
Electrostatic bonding between glass and silicon is carried out in micro sensor devices to achieve higher bond strength thus eliminating the requirement of adhesives. This can also be useful in providing hermiticity and results in reliable operation of the micro sensor devices. Practically the sensor performance is prone to long term drift mainly due to process associated with the assembly and packaging. Bonding is the one of the critical process in micro sensor and generally sensor stability is dependent on this process along with other packaging material and methodology. Bond strength is one of the critical parameters to find out the quality of bond and the same is quantified and compared for different conditions. This article details electrostatic bonding process, various parameters responsible for the reliable bonding, modelling and characterization along with simple methodology to achieve higher bond strength.Keywords
Bonding, Micro-Sensor, Anodic, Electrostatic, Sensor, Bond Strength.References
- Kamaljeet Singh and A.V. Nirmal, “Reliability Aspects in RF-MEMS Circuits for Space Applications”, Journal of Engineering and Technology Research, Vol. 4, No. 6, pp. 1-11, 2016.
- W.H. Ko, J.T. Suminto and G.J. Yeh, “Bonding Techniques for Microsensors”, Proceedings of Conference on Micromachining and Micropackaging of Transducers, pp. 41-61, 1985
- Mohamed Gad-el-Hak, “The MEMS Handbook”, 2nd Edition, CRC Press, 2002.
- K. Petersen, P. Barth, J. Poydock, J. Brown, J. Mallon and J. Bryzek, “Silicon Fusion Bonding for Pressure Sensors”, Proceedings of IEEE Solid State Sensor and Actuator Workshop, pp. 144-147, 1998.
- Hyun S. Kim, Robert H. Blick, D.M. Kim and C.B. Eom, “Bonding Silicon-on-Insulator to Glass Wafers for Integrated Bio-Electronic”, Applied Physics Letters, Vol. 85, No. 12, pp. 2370-2373, 2004.
- R. Knechtel, G. Dahlmann and U. Schwarz, “Low and High Temperature Silicon Wafer Direct Bonding for Micromechanical Absolute Pressure Sensor”, Proceedings Electromechanical Society, pp. 205-207, 2005.
- G. K. Ananthasuresh, K.J. Vinoy, S. Gopalakrishnan, K.N. Bhat and V.K. Aatre, “Micro and Smart Systems”, Wiley, 2010.
- Process and Modelling Aspects of Polyimide Over Silicon for RF Circuits Realization and its Implementation
Abstract Views :150 |
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Authors
Affiliations
1 U R Rao Satellite Centre, Indian Space Research Organisation, IN
1 U R Rao Satellite Centre, Indian Space Research Organisation, IN
Source
ICTACT Journal on Microelectronics, Vol 5, No 1 (2019), Pagination: 711-714Abstract
The integration of RF circuits with CMOS on the same substrate is challenging and imposes lot of constraint in practical realization due to inherent losses associated with silicon Si substrate. Various mitigation techniques are proposed to overcome the same which are either process intensive or introduces multiple deleterious effects at RF frequencies. Polyimide is used both in microelectronics and MEMS industry as it can act both as a photo-resist and also having key dielectric properties. The processes presented with polyimide are standard and can be easily integratable with the existing CMOS processes. Fabrication steps and simulation study of the band pass filter topologies over polyimide are presented and the same are fabricated with the proposed process steps. Further this article details the modelling, theoretical aspects, various process steps and actual implementation with the realization of the band pass filter topology using the proposed methodology.Keywords
Polyimide, Silicon, Radio Frequency, Modelling.- Process for Implementation of Transmission Line on Standard Silicon Substrate and its Characterization at Ka-Band
Abstract Views :149 |
PDF Views:0
Authors
K. Singh
1,
A. V. Nirmal
1
Affiliations
1 System Engineering Group, U R Rao Satellite Centre, IN
1 System Engineering Group, U R Rao Satellite Centre, IN